| 摘要 |
A system ( 10 ) is disclosed having a circuit portion ( 18,26,36 ) containing more than electrical conductors and a wirebonded assemblage ( 12,14,16 ) overlying the circuit portion ( 18,26,36 ). The wirebonded assemblage ( 12,14,16 ) comprises a plurality of wirebonded wires (( 50,52 ),( 60,64 ),( 66,68 )), each of the plurality of wirebonded wires being electrically coupled. The wirebonded assemblage ( 12,14,16 ) provides electrical shielding for the circuit portion ( 18,26,36 ). In one embodiment, the wirebonded assemblage provides for heat spreading.
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