发明名称 |
Stacked packaging methods and structures |
摘要 |
A packaging method and structures are disclosed. A first die is mounted on a package substrate. A chip scale package is mounted on the first die. The chip scale package comprises a chip scale package substrate and a second die mounted on a first surface of the chip scale package substrate. A third die is mounted on a second surface of the chip scale package substrate. Accordingly, the height of the stacked package can be reduced.
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申请公布号 |
US2006043556(A1) |
申请公布日期 |
2006.03.02 |
申请号 |
US20040925488 |
申请日期 |
2004.08.25 |
申请人 |
SU CHAO-YUAN;TSAO PEI-HAW;HUANG CHENDER |
发明人 |
SU CHAO-YUAN;TSAO PEI-HAW;HUANG CHENDER |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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