发明名称 |
RESIN MOLDING CUTTING METHOD AND RESIN MOLDING CUTTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding cutting method and device capable of thermally cutting a resin molding with high accuracy and contiunuously at high speed. SOLUTION: A heating line 8 is composed of a heating element extending in band shape with its cross section S shaped to be larger in width than the thickness. The heating line 8 is formed in thin plate shape so that the ratio (H/W) of the width H to the thickness W of the cross section S is 1.5-100, preferably 2.5-25. A molded sheet is thermally cut with the heating line 8 by being moved to cross the heating line 8 from one end side to the other end side in the width direction of the heating line 8 of such a shape. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006015437(A) |
申请公布日期 |
2006.01.19 |
申请号 |
JP20040194101 |
申请日期 |
2004.06.30 |
申请人 |
HOKUEI KAKO KK;SEKISUI PLASTICS CO LTD |
发明人 |
ISHIDA FUMIO;SHINOHARA KIYOSHI;WATANABE MITSUO;FUKAI NORIAKI |
分类号 |
B26F3/08;B26D7/10 |
主分类号 |
B26F3/08 |
代理机构 |
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代理人 |
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地址 |
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