发明名称 RESIN MOLDING CUTTING METHOD AND RESIN MOLDING CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resin molding cutting method and device capable of thermally cutting a resin molding with high accuracy and contiunuously at high speed. SOLUTION: A heating line 8 is composed of a heating element extending in band shape with its cross section S shaped to be larger in width than the thickness. The heating line 8 is formed in thin plate shape so that the ratio (H/W) of the width H to the thickness W of the cross section S is 1.5-100, preferably 2.5-25. A molded sheet is thermally cut with the heating line 8 by being moved to cross the heating line 8 from one end side to the other end side in the width direction of the heating line 8 of such a shape. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006015437(A) 申请公布日期 2006.01.19
申请号 JP20040194101 申请日期 2004.06.30
申请人 HOKUEI KAKO KK;SEKISUI PLASTICS CO LTD 发明人 ISHIDA FUMIO;SHINOHARA KIYOSHI;WATANABE MITSUO;FUKAI NORIAKI
分类号 B26F3/08;B26D7/10 主分类号 B26F3/08
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