发明名称 |
Multi-layer fet array and method of fabricating |
摘要 |
A power array includes a plurality of FET power assemblies and each FET power assembly has at least one field effect transformer mounted to a circuit board. The circuit boards are arranged atop each other. A power supply pin extends through the circuit boards and is connected to a power input of each field effect transformer. A power output of each FET power assembly is connected to a power output pin which extends through each of the circuit boards. A heat sink is mounted to the power array beneath the lowest FET power assembly and is thermally connected to the field effect transformers of each FET power assembly. A method of assembling a power array including a plurality of FET power assemblies with at least one field effect transformer.
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申请公布号 |
US2005212122(A1) |
申请公布日期 |
2005.09.29 |
申请号 |
US20040863153 |
申请日期 |
2004.06.07 |
申请人 |
DUGGAN MICHAEL R;LOPES NAZARIO |
发明人 |
DUGGAN MICHAEL R.;LOPES NAZARIO |
分类号 |
H01L21/44;H01L23/34;H05K1/14;H05K3/34;(IPC1-7):H01L23/34 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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