Spacerless die stacking

摘要

An embodiment of the present invention is a technique to stack dies in a die assembly. A plurality of dies are stacked on top of one another in a staggering configuration such that an upper die top surface in a pair of adjacent dies faces downward or upward and is displaced by a first distance with respect to a lower die in the pair. The adjacent dies are attached by an adhesive layer between the adjacent dies.