发明名称 |
Semiconductor device manufacturing method |
摘要 |
The present invention provides a method for manufacturing a semiconductor device comprising steps of: bonding one semiconductor chip to each of multiple mounting portions of a substrate; covering the semiconductor chips bonded to the mounting portions with a common resin layer; bringing the substrate into contact with the resin layer and gluing the substrate to an adhesive sheet; and performing dicing and measurement for the semiconductor chips that are glued to the adhesive sheet.
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申请公布号 |
US6737285(B2) |
申请公布日期 |
2004.05.18 |
申请号 |
US20010900093 |
申请日期 |
2001.07.06 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
IKETANI KOJI;TANI TAKAYUKI;SHIBUYA TAKAO;HYODO HARUO |
分类号 |
H01L23/12;H01L21/301;H01L21/56;H01L21/66;H01L21/68;H01L23/28;H01L23/31;(IPC1-7):G01R31/76 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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