| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce damages on a substrate of a film to be processed when depositing the film using the energy ray. <P>SOLUTION: A processing apparatus to selectively process a processing area of a processed film formed on a substrate comprises a holding unit to hold the substrate, an irradiation unit to irradiate the energy ray to each processing unit set in the processing area, a detection unit to illuminate observation light on each processing unit and detect the intensity of the reflected light from the processing unit, a setting unit to set the energy quantity of the energy ray to be irradiated on each processing unit according to the detected intensity of reflection, and a control unit to control the energy quantity of the energy ray irradiated on each processing unit from the irradiation unit. <P>COPYRIGHT: (C)2004,JPO</p> |
