METHOD AND EQUIPMENT FOR DETERMINING MACHINING DIMENSION OF JOINT COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide equipment and a method for determining the dimension of a bonding film which bonds an object whose dimension changes by a temperature change under an environmental temperature different from a temperature at the time of use. SOLUTION: A bonding method of a circuit electrode (2) is provided with a process (S404) for measuring the survey dimension of a bonding part of the circuit electrode (2) at a first temperature (T1), a process (S406) for comparing the survey dimension (Lm(T1)) of the bonding part with a design dimension (Lt(T1)) of the bonding part at the first temperature (T1), and a process (S408, S410) wherein the dimension (Nca) of a joint component (4) is determined on the basis of the compared result and the joint component (4) is arranged on a bonding part (8). COPYRIGHT: (C)2004,JPO