CIRCUIT BOARD MANUFACTURING METHOD AND ITS MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To solve the problem that, when a cover film is exfoliated, conductive paste with which a via-hole is filled up to the surface of the cover film is partially removed to increase a resistance value in interlayer connection. SOLUTION: There are provided a process in which the via-hole is filled by using a squeezee 7 with the conductive paste 6 put on the surface of an insulating board 1, and a process in which the cover film 4 is exfoliated pressing the surface of the cover film 4 in the direction of the insulating board 1. COPYRIGHT: (C)2004,JPO