| 摘要 |
A resin-molded device of an aspect of the present invention includes a plurality of electronic elements spaced from each other. It also has a plurality of lead members, each one of the lead members electrically connecting to the corresponding one of the electronic elements. Further, it has a plurality of metal blocks spaced from each other so that a plurality of channel portions are defined between the metal blocks. Each of the metal blocks is arranged so as to correspond to at least one of the electronic elements and the lead members connected to the electronic element. The resin-molded device includes a resin package of electrically insulating material molded so as to hold together the plurality of the electronic elements, the lead members, and the metal blocks. The resin package includes a plurality of resin inlets through which fluid resin is injected, and wherein each of the resin inlets opposes to the corresponding one of the channel portions. |
