发明名称 METHOD AND APPARATUS FOR MANUFACTURING WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a wiring circuit board that does not reduce the productivity of etching even if the space of a wiring pattern is small. SOLUTION: In the apparatus for manufacturing the wiring circuit board, an etching resist pattern in a prescribed shape is formed on a conductor layer that is laminated on an insulating layer, and a wiring pattern is formed by chemically etching the conductor layer. The apparatus comprises a plurality of etching tanks 11 and 12 for chemical etching, and etching liquid-eliminating means 21 and 22 that are provided at the rear flow side of each of the etching tanks 11 and 12. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003273495(A) 申请公布日期 2003.09.26
申请号 JP20020075652 申请日期 2002.03.19
申请人 NITTO DENKO CORP 发明人 TAKAMURA RYUICHI;WAKANA HIROYASU
分类号 H05K3/06;(IPC1-7):H05K3/06 主分类号 H05K3/06
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