发明名称 FILM-FORMING METHOD, FILM-FORMING APPARATUS, MANUFACTURING METHOD OF DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a film-forming method for flattening a film by suppressing lifting of ends of the film in drying, and to provide a film-forming apparatus. SOLUTION: The film-forming apparatus discharges a liquid material from a liquid discharge head 21 as droplets and forms the film of the liquid material on a substrate 20, which is a substance to be treated forming a pattern. A control means lessens the amount of arrangement of the liquid material arranged on the substrate 20 in a region 51 outside of a pattern region 50 as compared with the pattern area 50, in which the pattern is formed. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003273092(A) 申请公布日期 2003.09.26
申请号 JP20020073095 申请日期 2002.03.15
申请人 SEIKO EPSON CORP 发明人 ASUKE SHINTARO
分类号 B41J2/01;H01L21/027;H01L21/31;H01L21/316;(IPC1-7):H01L21/31 主分类号 B41J2/01
代理机构 代理人
主权项
地址