发明名称 POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad having increased polishing rate by improving the affinity of the slurry to the polishing pad. SOLUTION: The polishing pad is made of a polyurethane composition. The polyurethane composition contains a urethane resin copolymerized with a compound having a hydrophilic group and the composition contains a hydrophilicizing agent. The hydrophilicizing agent is one or more compounds selected from 2,4,7,9-tetramethyl-5-decyne-4,7-diol-dipolyoxyethylene ether, 2,4,7,9- tetramethyl-5-decyne-4,7-diol and polymethylalkylsiloxane and the compound having a hydrophilicizing group is one or more compounds selected from ethylene oxide monomer, propylene oxide monomer and ethylene propylene oxide monomer.
申请公布号 JP2003128910(A) 申请公布日期 2003.05.08
申请号 JP20010319788 申请日期 2001.10.17
申请人 RODEL NITTA CO 发明人 MORIGAMI TADAO;SHIMAMOTO IWAI
分类号 B24B37/20;B24B37/24;C08J5/14;C08K5/053;C08L71/02;C08L75/04;C08L83/04;H01L21/304 主分类号 B24B37/20
代理机构 代理人
主权项
地址