| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of semiconductor devices, which is contrived so as to be able to identify the positions of a plurality of the semiconductor devices on a wafer. SOLUTION: The manufacturing method of semiconductor devices has a process that semiconductor device patterns are moved in order on a wafer 100 by the widthΔX of regions 101 on the wafer 100, and that the device patterns are exposed in order on the wafer 100, has a first process that scale patterns 102x and 102y are exposed in the direction to coincide with the direction of movement of the device patterns at the time when the device patterns are exposed in order in every region 101, where the device patterns are exposed, and a second process that the device patterns are moved in order on the wafer 100 by a distance (ΔX+A) longer as much as one scale than the widthΔX of the regions 101 moved in order on the wafer when the device patterns are exposed in order, and a mark is exposed to the positions along the scale positions 102x and 102y. |
