| 摘要 |
PROBLEM TO BE SOLVED: To double the mounting density, concerning a film carrier type of semiconductor part. SOLUTION: The package structure of this integrate circuit is of such a structure that a semiconductor chip 4 having a bump electrode is mounted on one side and a semiconductor chip 5 manufactured in mirror inversion is mounted on the other side in opposition, from both sides of a film carrier tape, using a film carrier tape having double-faced wirings 2 and 3. The mirror- inverted semiconductor chip 5 is one which is arranged so that the bump electrode may be positioned in the same place, in opposition to the bump electrode position of the semiconductor chip 4, whereby it can double the mounting density and the wiring density and equalize the load at connection between the bump electrode and the wiring conductor of the film carrier tape. |
