| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead material for electronic parts applied with hot dip plating of an Sn alloy, in which the joining strength of soldering is excellent, and discoloration and the reduction of the wettability of solder do not occur in a heating stage. SOLUTION: In the lead material for electronic parts obtained by applying hot dip plating of an Sn alloy on an electrically conductive substrate, the Sn alloy contains, by weight, 0.2 to 5% Cu, furthermore, 0.001 to 5% Zn or/and 0.001 to 5% In, and the balance Sn with inevitable impurities. Since the Sn alloy is plated by a hot dip plating method, whiskers are not generated. Moreover, since the Sn alloy does not contain Pb, the environment is not contaminated, the joining strength of soldering is excellent becuase of the incorporation of a suitable amount of Cu, and discoloration does not occur in a heating stage at the time of assembling electronic parts because of the incorporation of a suitable amount of Zn or/and In.
|
