发明名称 |
Apparatus for polishing a substrate and a rotatable platen assembly therefor |
摘要 |
<p>A chemical mechanical polishing system is provided having one more polishing stations (32). The polishing stations (32) include a platen (41) and pad (44) mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area (60) and a recessed area (62). The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate. <IMAGE> <IMAGE></p> |
申请公布号 |
EP1050374(A3) |
申请公布日期 |
2001.03.21 |
申请号 |
EP20000302744 |
申请日期 |
2000.03.31 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TOLLES, ROBERT D.;MEAR, STEVEN T.;PRABHU, GOPALAKRISHNA B.;HUEY, SIDNEY;REDEKER, FRED C. |
分类号 |
B24B37/16;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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