| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency circuit device that miniaturization and weight reduction are attained as a whole by reducing the size of each mounted function device itself and connecting each function device and a strip line closely with each other. SOLUTION: The high frequency circuit device is provided with a device element 30 that configures a function device, a line element 20 that configures a strip line, and a conductor case 10 that contains the device element 30 and the line element 20, acts an a ground conductor for them, and configures the strip line. A circuit pattern 32 and a device side connection section 321 are provided on a base 31 of the device element 30. A strip conductor 22 and a line side connection section 221 are provided on a 1st dielectric board 21 of the line element 20. The line side connection section 221 and the device side connection section 321 are made to counterpose to each other, and a conductor chip 101 is interposed between them to connect the device element 30 and the strip conductor 22. |
