发明名称
摘要 A dielectric for planarisation which is particularly suitable for electronic devices fulfils the required characteristics to a high degree if it is composed of a matrix of a highly heat-resistant organic polymer which incorporates a fine dispersion of a solid filler which can be etched in an oxygen plasma and which has high conductivity and good dielectric properties.
申请公布号 JP3080965(B2) 申请公布日期 2000.08.28
申请号 JP19900111597 申请日期 1990.04.25
申请人 发明人
分类号 C08K3/04;C08K3/02;C08L79/04;C08L79/08;H01B3/00;H01B3/30;H01G4/20;H01L21/312;H01L23/29;H01L23/373;(IPC1-7):H01B3/00 主分类号 C08K3/04
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