| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where solder balls are restrained from falling off when a reflow operation is carried out for mounting the semiconductor device on a printed board. SOLUTION: A multi-chip semiconductor device is composed of a wiring- attached film 1 provided with a prescribed wiring pattern on its surface, semiconductor chips 2 mounted on the wiring-attached film 1, solder balls 9 arranged in an array on the second surface 1b of the wiring-attached film 1 and connected to the wiring pattern of the wiring-attached film 1 at prescribed positions, and a stiffener 4 bonded to the first surface 1a of the wiring-attached film 1 through the intermediary of an adhesive agent 7. In this case, the stiffener 4 formed of copper plate is formed as thick as 0.15 to 0.30 mm.
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