| 摘要 |
PROBLEM TO BE SOLVED: To prevent a thin-film wiring conductor from being disconnected effectively by increasing the junction strength between a conductive layer formed on the inner wall of the through hole of an insulation substrate and an organic resin filling body and preventing the position deviation of the organic resin filling body. SOLUTION: A wiring board consists of an insulation substrate 1 with a through hole 5 that is penetrated through both upper and lower main surfaces, a conductive layer 6 that is led from the upper surface of the insulation substrate 1 to the lower surface via the inner wall of the through hole 5, an organic resin filling body 7 that is filled into the inside of the through hole 6, and a multilayer wiring part 4 that is deposited on at least one main surface of the insulation substrate 1, alternately has an organic resin insulation layer 2 and a thin-film wiring conductor 3, and at the same time where one part of the thin-film wiring conductor 3 is electrically connected to the conductive layer 6. In this case, the surface roughness of the conductive layer 6 formed on the inner wall of the through hole 5 of the insulation substrate 1 ranges from 0.05μm to 5μm. |
