SEMICONDUCTOR DEVICE CONNECTION APPARATUS AND MANUFACTURE OF THE SAME

摘要

The method is for enhancing the reliability and the productivity of a semiconductor device by preventing the damage of a semiconductor substrate due to a void generated by the polycrystalline silicon film. The device is characterized by comprising: several conduction lines on top of a semiconductor substrate; a bottom insulation layer on top of the conduction lines; a contact hole revealing the semiconductor substrate; and a plug which is formed by stacking a first polycrystalline silicon film and a second polycrystalline silicon film in the contact hole.