CIRCUIT BOARD HAVING CONDUCTIVE THICK FILM AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing relatively easily a conductive thick film which is excellent in plating resistance and high in surface smoothness, regardless of the type of the thick film. SOLUTION: A conductive thick film 12 containing glass 14 and metallic particles 13 and 13 coupled thereby is formed on a substrate body 11 of the circuit board 10, and a plated film 16 is formed on the conductive thick film 12. The conductive thick film 12 is set to have a surface roughness of 0.2μm or less in an average roughness factor. At the time of manufacturing the circuit board 10, conductive paste is first coated on the substrate body 10, dried and then burned to thereby form the conductive thick film 12 on the substrate body 10. The conductive thick film 12 is subjected thereon to a mechanical polishing operation to thereby cause the film 12 to have a surface roughness of 0.2μm or less in an average roughness factor. The film 12 after subjected to the mechanical polishing operation is further subjected thereon to an electroplating process or electroless plating process to form the plated film 16.