| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for attaching an identification symbol on the rear surface of a chip by a simple method and an apparatus. SOLUTION: A mark tape 11 is stuck onto a dicing tape 12, and a wafer 13 is stuck thereon. A wafer 13 is divided together with the tape 11 to manufacture a chip 22. The sticking strength between the tape 11 and the tape 12 is smaller than that between the tape 11 and the wafer 13. Accordingly, when the chip 22 is taken up by the tape 12, the tape 11 is stuck to the chip 22.</p> |
