| 摘要 |
PROBLEM TO BE SOLVED: To lessen a stress on a bonding pad in a semiconductor device assembly process so as to improve a semiconductor device in reliability by slitting a bonding pad. SOLUTION: A slit 32 is provided in a bonding pad 30 provided on a semiconductor device. For instance, the slit 32 above 3μm in width is provided in the bonding pad 30 along its edge. As shown in the Fig. it is preferable that the slit 32 is continuously provided in the bonding pad 30 avoiding a part 34 which faces the center (downwards in the Fig.) of a chip. By this setup, ductile molding compound is embedded in the slit 32 after wire bonding is finished, whereby stress on the bonding pad 30 due to wire bonding can be lessened.
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