| 摘要 |
PURPOSE: To prevent the occurrence of inferiority caused by artificial error by providing a reject means which performs the processing for discrimination to the semiconductor device which is judged to be inferior or subject to other discrimination. CONSTITUTION: In wire bonding inspection, a function of receiving the input of data for reject function, in addition to ordinary teaching data, and storing them into a storage device 14 is added. That is, the teaching data for reject function is inputted in the form of designating, on coordinates, the position of punching at the time of inferiority occurrence, based on the alignment mark of a lead frame 2 or a semiconductor chip 1. For example, the position coordinate varying with inspection items are designated, according to the case that the contents of inferiority is different such as the case of form inferiority on the side of a first bond and the case of form inferiority of a wire. And, it can be stored in the storage device 4. |
