Structure and method of coupling substrates

摘要

A flip-chip structure and method connects a semiconductor chip (11) having conductive bumps (16) to a substrate (12) having vias (19) extending from a first side (21) to a second side (18) of the substrate (12). A filler material (22) is deposited into the vias (19), and the conductive bumps (16) are inserted into the vias (19) for connecting the semiconductor chip (11) to a conductive element (17) covering the vias (19) on the second side (18) of the substrate (12).