发明名称 HEAT PUMP
摘要 PURPOSE:To efficiently evaporate a refrigerant in an evaporator by connecting a delivery pipe with a nozzle as a liquid thin film forming device to the suction side of a compressor via an oil separator. CONSTITUTION:Refrigerant discharged from a compressor 4 is liquefied in a condenser 7 and flows into an evaporator l. Then, the refrigerant is sprayed from a nozzle 26 of a delivery pipe 25 into time evaporator l by a pump 22 of line evaporator 1 so that it turns to a liquid thin film and comes in contact with the inner wall of the evaporator 1. The liquid thin film of the refrigerant absorbs the terrestrial heat via the inner wall as it flows down along the inner wall, and evaporates to gas. The vaporized refrigerant is sucked into a compressor 4 and circulated to a heat pump cycle 21. Therefore, when time load side is connected to a heat exchange part of the condenser 7, the refrigerant flowing into an oil separator 28 from the delivery pipe 25 is evaporated in the oil separator 28 to remove impurities such as oil, and sucked into the compressor 4. Thereby, the refrigerant cant be efficiently evaporated in the evaporator 1.
申请公布号 JPH07198227(A) 申请公布日期 1995.08.01
申请号 JP19910238371 申请日期 1991.09.18
申请人 AGENCY OF IND SCIENCE & TECHNOL 发明人 SAYAMA SOGO;TAKEUCHI HIROSHI;KASAHARA KEISUKE;YONEDA HIROKAZU
分类号 F25B1/00;F25B30/06;F25B39/02;(IPC1-7):F25B30/06 主分类号 F25B1/00
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