| 摘要 |
PURPOSE:To prevent corrosion of a rear metal film and to improve humidity resistance, by inserting a conductive film moisture resistance higher than the metal film between a resin surface and the metal film. CONSTITUTION:A conductive film 2 high in humidity resistance is formed on a resin surface of a board 1, a rear metal film 3 is formed on the film 2, a semiconductor optically active layer 4 in which amorphous silicon, etc., is laminated on a p-n or p-i-n is formed on the metal film, and a transparent conductive film 5 made of ZnD, ITO, SnO2, etc., is formed on the layer 4. An output is lead via the films 3, 5. In this case, when the film 3 is made of Al, Cu, Fe, etc., the material of the film 2 is suitably selected from materials of Ti, Ni, Sn, etc., higher in humidity resistance than Al, etc. Thus, corrosion of the metal film can be prevented, and humidity resistance of an optical semiconductor device is improved. |
