METHOD OF DETECTING STACKED SLIPPAGE OF MULTILAYER INTERCONNECTION PRINTED BOARD

摘要

PURPOSE:To make it possible to detect the stacked slippage during formation of a multilayer interconnection printed board easily in a short time. CONSTITUTION:Clearances 18 formed by arranging a plurality of pairs of power layers and earth layers in an inner layer of a coupon 13 for detection installed on a multilayer printed wiring board 11 are provided. Patterns 15a and 15b for detection are formed on the surface layer of the coupon 13 for detection so as to extend the region between the clearances 18 of each pair of the power layers and earth layers, and a characteristic impedance of the patterns 15a and 15b for detection is measured, and thereby the stacked slippage of the multilayer printed wiring board 11 is detected.