CONNECTION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To fill up clear holes with solder and to independently connect plural conductors by providing an insulating substrate which holds semiconductor elements with through conductors in a latticed state wherein the conductors are connected to input and output terminals of the elements and a printed substrate having clear holes at the positions correspond to these conductors respectively is connected to the insulating substrate. CONSTITUTION:Conductors 21 which penetrate an insulating substrate 20 is provided in a latticed state. And solder 24 is installed. LSI23 are fixed to the surface of a distributing layer 22. Pins 25 located at the corners of the substrate are soldered and used as power and grounding terminals. A printed distributing board 30 is provided with clear holes 40 correspond to the conductors 21. The inside of the holes is plated and lands 41 are connected to inner layer conductors 42. Pins 25 are inserted in desired clear holes to contact the lands 41 and solder 24. Connection will be accomplished after filling up melting solder through the clear holes 40. This constitution permits micropackages having many input and output signals to connect in a short time and under high reliability.