CIRCUIT BOARD WITH SPARE SOLDER LAYER,申请号JP19900317685-传众专利搜索

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发明名称	CIRCUIT BOARD WITH SPARE SOLDER LAYER
摘要
申请公布号	JPH04192394(A)	申请公布日期	1992.07.10
申请号	JP19900317685	申请日期	1990.11.26
申请人	FURUKAWA ELECTRIC CO LTD:THE;HARIMA CHEM INC	发明人	FUSE KENICHI;FUKUNAGA TAKAO;KONO MASANAO;IRIE HISAO
分类号	H05K3/34;H05K3/24	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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