| 摘要 |
<p>PURPOSE:To obtain a chip of uniform shape without accident by adhering lead solders to both side surfaces of a substrate and then dividing it into semiconductor chips by a sand blast dicing method. CONSTITUTION:Low melting point lead-tin solders 2 are adhered in thickness of 20-30mum on both main surfaces of a semiconductor substrate 1 having P-N junction and plated with metal. Labeling plate 4 is secured via wax 3 to the back surface of the substrate, and a dicing disc 5 is secured via wax 3 to the front surface. A sand blast dicing method is performed for the substrate, the disc 5 is separated from the plate 4, and a semiconductor chip 6 can be obtained. Thus, the creeping of the polishing agent to the edge of the chip can be prevented at the sand blast dicing time to average the shape, and the oxidation of the metal plated layer can be eliminated.</p> |
