| 摘要 |
<p>To reduce manufacturing costs of semiconductor components, for example TO-92 transistors or thyristors, said components have a prefabricated plastic casing (1) filled with cast resin (2), and the semiconductor body (4), together with its leads (3) and the corresponding synthetic resin cover (5), are inserted in the cast resin (2) and the casing (1). Parts of the leads are engaged in a channel (61, 60, 62) inside the casing. Insertion in the casing is effected by means of a device comprising a feed rail (10) on which the casing runs, a centering slide (11) and a swivelling gripper (12) onto which the casings are slid by means of the centering slide. When rotated, the swivelling gripper (12) sets the casings on the semiconductor bodies (4) positioned on the mounting stri (8). All processing steps can be carried out at one and the same assembly station comprising the semiconductor positioning station (23), the bonding station (24), the covering station (25), the casing positioning station (26) corresponding to the above-mentioned device and possibly the curing station (27), and hence the bare mounting strip (8) can be wound off its roll (81) into the assembly station and the assembled mounting strip (88) can be wound onto its roll (82).</p> |
