发明名称 |
Method and apparatus for through hole substrate printing |
摘要 |
A method and apparatus for printing through holes in ceramic substrates and the like. The substrate is held in position by means of a vacuum applied to an outer peripheral surface portion thereof. The deposited substance is pulled through the holes in the substrate by means of a closely regulated vacuum applied only to an inner surface portion, the inner and outer vacuum areas being separated in a holder device by means of O-rings. A pressure-time profile which appears in a plenum closely adjacent to the inner chamber may be compared to a previously generated pressure-time profile reference and used to accept or reject parts.
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申请公布号 |
US4710395(A) |
申请公布日期 |
1987.12.01 |
申请号 |
US19860863145 |
申请日期 |
1986.05.14 |
申请人 |
DELCO ELECTRONICS CORPORATION |
发明人 |
YOUNG, WILLIAM M.;WOLFE, MARK E. |
分类号 |
H01L21/48;H05K3/12;H05K3/40;(IPC1-7):H05K3/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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