| 摘要 |
PURPOSE:To manufacture a copper alloy excellent in electric conductivity, heat resistance, and solderability, by incorporating specific percentage of Pb and Sn to Cu and by limiting O2 content to a specific quantity or below. CONSTITUTION:The copper alloy which consists of, by weight, 0.003-0.3% Pb, 0.001-0.01% Sn, and the balance Cu and in which O2 content is regulated to <=50ppm is prepared. This copper alloy is excellent in electric conductivity and heat resistance and is suitable for heat-exchanger fin material, electronic and electric equipment parts material, etc., and, moreover, it enables lightening weight as well as miniaturization.
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