发明名称 Hollow microspheres with wall through-openings.
摘要 <p>Hollow microspheres or shells having wall through-openings, and methods for manufacture thereof, which find application as microcarriers for anchorage-dependent cell cultivation and as fillers for thermal insulation purposes. Hollow glass or polymeric shells having removal-susceptible wall zones carried by a wall matrix are chemically treated to remove the susceptible zones and thereby leave the matrix wall with through-openings. The shells may be vacuum coated to obtain a discrete reflective surface layer which seals an evacuated interior, or, in the case of glass, the shells may be vacuum sintered to close the through-openings, and then coated to obtain the reflective surface layer.</p>
申请公布号 EP0150288(A2) 申请公布日期 1985.08.07
申请号 EP19840113631 申请日期 1984.11.12
申请人 KMS FUSION, INC. 发明人 ANDERSON, PAUL RICHARD;WUTTKE, GILBERT HENRY
分类号 C03B19/08;B01J13/02;C03C11/00;C03C17/06;C04B20/00;C04B20/10;C04B38/00;C12N5/00;C12N5/02;(IPC1-7):C03C11/00;C03C17/00;C12N11/00;C04B14/00 主分类号 C03B19/08
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