| 摘要 |
<p>Aq. acidic soln. for chemically stripping metallic deposits from substrates contains HNO3, chloride ions and sufficient Mn ions to accelerate the initiation and rate of stripping. The soln. pref. contains 235-1050 g/l HNO3, 0.2 g/l to saturation of chloride, 0.2-10 g/l Mn ions, opt. 0.2-10 g/l cupric ions, 0.2-10 g/l ferrous ions, 0.2-10 g/l Ni ions. Used for stripping Cu, Ni, Ni-Fe, Ni-P, brass, Sn, Cd, Zn, Rh from the contact tips of electroplating racks. Faster stripping rate is achieved.</p> |
