发明名称 MANUFACTURE FOR LEAD WIRES FOR SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To establish the pad surface, by closely inserting the cylinder of noble metal to the tip of metal rod and pressing flat the tip together with the cylinder. CONSTITUTION:The copper cylinder 6 plated by silver 6 is inserted to the metal rods 8-A to 8-C, and it is clamped, and fed to a pair of pressing rollers 10 and 11 continuously, the tip is pressed flat to form the pad surfaces 12-A to 12-C. With this method, the material can be saved more than the noble metal coating on the entire rod. Since silver is present only on the pad surface, no occurrence of migration is caused to make stable the function of the device and to incerease the quality.</p>
申请公布号 JPS54162456(A) 申请公布日期 1979.12.24
申请号 JP19780071738 申请日期 1978.06.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 YANAGIYA KOUJI
分类号 H01L23/48 主分类号 H01L23/48
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