| 摘要 |
A method and apparatus for effecting a hermetic seal between an electronic component package and a package cover is disclosed. The method includes the steps of bonding a heater layer of conductive material to a sealing area of the package. A sealing material is then applied over a sealing area of the package cover. Optionally, a layer of sealing material may be applied over the conductive heater layer. The package and cover are contacted together and an electric current induced to flow within the conductive heater layer. The sealing material reacts to the heat caused by the electric current flowing in the heater layer, and bonds to the heater layer to effect a hermetic seal. Additionally, the seal can be intentionally broken by a reheating process to allow for repair or replacement of the electronic components contained within the package, and then resealed by the above described method.
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