| 摘要 |
PURPOSE:To prevent generation of wire residue on a bump electrode which is finally formed. CONSTITUTION:A wire 3 inserted into an insertion hole of a capillart 1 is led out from the capillary lower end, and a ball (a) is formed. The ball (a) is pressed by the capillary lower end, and a bump electrode is formed in an electrode-leading out region 7 of a semiconductor pellet 6. Together with 4 clamping of the wire 3, ultrasonic wave vibration is applied, and cracks are generated in a wire neck part (b) stretching from a bump electrode at the cappillary lower end. On the basis of the cracks, the wire 3 is cut out by pulling up the capillary 1. An insertion hole aperture 11 of the capillary lower end has an edge part 12 whose hole diameter is nearly equal to the wire diameter in one radial direction. The radial direction perpendicular to the above radial direction constitutes a taper surface 13 whose diameter contracts from a hole diamer larger than the wire diameter. The application direction of the ultrasonic wave vibration is made to coincide with one radial direction having a hole diameter nearly equal to the wire diameter. |
