| 发明名称 |
LOW PROFILE IC PACKAGE |
| 摘要 |
An IC package without using an interposer is disclosed to form a low profile IC package. A single redistribution layer is fabricated according to IC process. A plurality of bottom pads is formed on a bottom of the single redistribution layer adaptive for the IC package to mount onto a mother board. A plurality of top pads is formed on a top of the single redistribution layer. An IC chip mounts on the plurality of top pads. A first molding compound wraps the single redistribution layer on four sides; and a second molding compound embeds the IC chip on top of the redistribution layer. |
| 申请公布号 |
US2016284620(A1) |
申请公布日期 |
2016.09.29 |
| 申请号 |
US201615073852 |
申请日期 |
2016.03.18 |
| 申请人 |
HU Dyi-Chung |
发明人 |
HU Dyi-Chung |
| 分类号 |
H01L23/31;H01L21/78;H01L21/56;H01L23/00;H01L21/683 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A low profile IC package comprises:
a single redistribution layer comprises a plurality of bottom pads having a pad dimension and pad density adaptive for the IC package to mount onto a mother board; a plurality of top pads having a pad dimension and pad density adaptive for an IC chip to mount thereon; and a first molding compound wrapping around the single redistribution layer on four sides. |
| 地址 |
Hsinchu TW |
