| 摘要 |
PURPOSE:To make an IC chip thinner at even wire loop level for increasing the bonding precision even if the surface of the IC chip is not flattened. CONSTITUTION:Within the title wirebonding method, a bonding arm holding a wire inserted bonding tool is swingably supported by a supporting mechanism so as to bring the bonding tool into contact with or separated from an element to be bonded to perform the wirebonding step. Through these procedures, the element to be bonded can be wirebonded at almost even level by detecting respective levels of the pad of an IC chip 34 and a lead 31 by the position detector of the bonding tool so as to loop-control the chip 34 at the previously specified target level even if the IC chip 34 is obliquely die-bonded. |
