A method of manufacturing a lighting module comprises: mounting one or more light emitting diode (LED) packages on a circuit board to define a lighting unit; and injection overmolding the entire lighting unit except the one or more LED packages using a single type of overmolding material. A lighting module comprises: one or more LED packages mounted on a circuit board; and an injection overmolding sealing the circuit board, the injection overmolding not having openings corresponding to piece holding pins, the injection overmolding not covering at least a light emitting portion of the one or more LED packages.
申请公布号
EP2126962(A4)
申请公布日期
2014.09.03
申请号
EP20080744058
申请日期
2008.03.19
申请人
GE LIGHTING SOLUTIONS, LLC
发明人
NALL, JEFFREY;STIMAC, TOMISLAV;LI, CHENYANG;GAO, CHUNMEI;SAHA, BABI, KOUSHIK;XIE, SHANSHAN;HALLEY, DOUGLAS, R.