Tree based adaptive die enumeration

摘要

A system and method for efficiently addressing dies in a three-dimensional stacked integrated circuit. Multiple stacked dies may be included in a single package or module. At least two of the dies are vertically stacked. One or more of the dies may include die enumeration logic that generates a unique die address space identifier (ID) for a particular die. Unless a die is a base die, each die receives a unique die ID for itself from a die placed below itself. The die then generates a unique die ID for one or more dies placed above itself and sends these die IDs to the dies located on top of itself. If a die is a base die, then the logic may receive a root value for a first unique die ID within the vertical stack from the package substrate or silicon based interposer beneath it.

主权项

1. A stacked integrated circuit comprising:
a plurality of dies wherein at least two dies of the plurality of dies are vertically stacked and at least one given die of the plurality of dies comprises die enumeration logic; wherein said logic is configured to:
receive a first die identifier (ID) from a first die of the plurality of dies placed below the given die;alter the received first die ID based on a number of dies placed above the given die in order to generate a second die ID; andsend the second die ID to a second die of the plurality of dies placed above the given die;wherein in response to detecting the given die is not a base die of a multi-tower stacked die configuration, the logic is further configured to receive the first die ID from a die placed immediately below the given die which also generated the first die ID.