| 摘要 |
The invention relates to an optoelectronic component, comprising a carrier element (101, 111, 121) having a heat sink, at least one electrically contacted semiconductor chip (102) mounted on the carrier element (101, 111, 121) for emitting electromagnetic radiation, a cover (201), which is transparent to radiation and arranged downstream of the at least one semiconductor chip (102), a converter layer (202), which is applied to the cover (201) that is transparent to radiation and which is spaced from the at least one semiconductor chip (102), a frame (204) made of thermally conductive material that extends around the at least one semiconductor chip (102), which frame is in direct contact with the converter layer (202), and at least one connecting element (210) for thermally connecting the frame (204) to the heat sink. The invention further relates to a method for producing an optoelectronic component. |
