COMPONENT BUILT-IN WIRING BOARD AND HEAT RADIATION METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To efficiently radiate heat from an electronic component thereby resolving problems such as destruction of a mounting portion due to the heat generated from the electronic component in a component built-in wiring board formed by burying the electronic component in an insulation member.SOLUTION: A component built-in wiring board is formed so as to include: at least a pair of wiring layers; an insulation member disposed between the pair of wiring layers; an electronic component buried in the insulation member; and a metal body that is disposed in the insulation member, the metal body where a recessed part for housing a non active surface and a side surface of the electronic component is formed.