发明名称 |
Semiconductor Package Having an Interposer Configured for Magnetic Signaling |
摘要 |
There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the active die, and an interposer magnetic tunnel junction (MTJ) pad in the interposer for receiving the magnetic signal. A sensing circuit is coupled to the interposer MTJ pad for producing a receive electrical signal corresponding to the magnetic signal. In one implementation, the sensing circuit is configured to sense a resistance of the interposer MTJ pad and to produce the receive electrical signal according to the sensed resistance.
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申请公布号 |
US2013193587(A1) |
申请公布日期 |
2013.08.01 |
申请号 |
US201213361598 |
申请日期 |
2012.01.30 |
申请人 |
CHEN XIANGDONG;ZHAO SAM ZIQUN;HU KEVIN KUNZHONG;KARIKALAN SAMPATH K. V.;KHAN REZAUR RAHMAN;VORENKAMP PIETER;BROADCOM CORPORATION |
发明人 |
CHEN XIANGDONG;ZHAO SAM ZIQUN;HU KEVIN KUNZHONG;KARIKALAN SAMPATH K. V.;KHAN REZAUR RAHMAN;VORENKAMP PIETER |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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