发明名称 |
Circuit substrate and method of manufacturing same |
摘要 |
A circuit substrate is presented. The circuit substrate comprises internal terminal electrode 2; a substrate 1; a wiring layer 21 formed on a portion of the surface of the substrate and having one end thereof connected to the internal terminal electrode; an insulating film contacting as a surface with the wiring layer; and an external terminal electrode 9 connected to the other end of the wiring layer and used for connecting to the exterior. The angle of the cross-section of the wiring layer taken perpendicularly to the surface of the substrate in the edge portion that the wiring layer contains is 55° (55 degree) or less, and the wiring layer that contains multiple mutually independent columnar crystals extending perpendicularly in a direction different from the direction of the surface of the substrate.
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申请公布号 |
US2012193799(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
US201213371323 |
申请日期 |
2012.02.10 |
申请人 |
SAKUMA MASAO;OTSUKA KANJI;SKLINK CO., LTD. |
发明人 |
SAKUMA MASAO;OTSUKA KANJI |
分类号 |
H01L23/532;H01L23/528 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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