| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad that is suitable for planarizing at least one of a semiconductor substrate, an optical substrate and a magnetic substrate. <P>SOLUTION: The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed by a prepolymer reaction of prepolymer polyol and polyfunctional aromatic isocyanate. The isocyanate-terminated reaction product has 4.5 to 8.7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from a group composed of curative polyamine, curative polyol, curative alcoholamine and mixtures thereof. The polishing pad contains at least a 0.1 volume percent filler or porosity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
